Material Data Sheet
Material: VESPEL® SP-3
15 % Molybdenum Disulfide PolyimideVespel® SP-3 is 15% moly-filled (molybdenum disulfide solid lubricant) for wear and friction resistance in vacuum and other moisture-free environments where graphite actually becomes abrasive. Typical applications of Vespel® SP-3 include seals, bushings, bearings, gears, and ultra-high vacuum or dry gas applications.
| These are machined properties and are non-directional | |||||
| Physical Properties | Test Method ASTM | Value | Units | ||
| Density | D-792 | 1.60 | lb/in³ | ||
| Water Absorption 24hrs. @73˚F | D-570 | % | |||
| Mechanical Properties | |||||
| Hardness, Rockwell E | D-785 | 40-55 | |||
| Tensile Strength Ultimate @ 73˚F | D-1708 | 7,500 | psi | ||
| Tensile Strength Ultimate @ 500˚F | D-1708 | 3,500 | psi | ||
| Flexural Modulus @ 73˚F | D-790 | 475 | 103psi | ||
| Flexural Modulus @ 500˚F | D-790 | 270 | 103psi | ||
| Flexural Strength Ultimate @ 73˚F | D-790 | 5,500 | psi | ||
| Flexural Strength Ultimate @ 500˚F | D-790 | 475 | psi | ||
| Compressive Stress @ 73˚F 1% Strain | D-695 | psi | |||
| Izod Impact, Notched @ 73˚ | D-256 | 0.4 | ft-lb/in | ||
| Izod Impact, Unotched @ 73˚F | D-256 | 2.1 | ft-lb/in | ||
| Electrical Properties | |||||
| Dielectric Constant @73˚F 102 Hz | D-150 | ||||
| Dielectric Strength Short Time 80 mils thick 73˚F | D-149 | Volts/mil | |||
| Dissipation Factor @ 73˚F 102 Hz | D-150 | ||||
| Arc Resistance | sec | ||||
| Thermal Properties | |||||
| CTE 73˚F - 572˚F | E-228 | 29 | 10-6 in/in/˚F | ||
| CTE - 80˚F - 73˚F | E-228 | 10-6 in/in/˚F | |||
| Thermal Conductivity | E-228 | 3.2 | BTU-in/hr-ft² °F | ||
| Maximum Service Temperature, Air | °F | ||||
| Flammability, UL94 | |||||
| *The values shown in these and the following charts are typical, average properties. Actual values may differ due to variations in resin formulations and processing methods. These values are obtained from sources believed to be reliable, including the resin manufactures, converters and other published sources. However, they should not be used for specification or design purposes. |
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