Material Data Sheet
Material: Vespel® SCP-50094
Vespel® SCP-50094 is designed for tougher applications and offers better thermal stability and chemical resistance than ST-2010. SCP-50094 is being used in aircraft engines and is excellent for ultra high stress applications.
| These are machined properties and are non-directional | |||||
| Physical Properties | Test Method ASTM | Value | Units | ||
| Density | D-792 | 1.44 | lb/in³ | ||
| Water Absorption 24hrs. @73°F | D-570 | 0.96 | % | ||
| Mechanical Properties | |||||
| Hardness, Rockwell M | D-785 | 70 | |||
| Tensile Strength Ultimate @ 23°C/73°F | D-638 | 12.8 | Kpsi | ||
| Tensile Strength Ultimate @ 260°C/500°F | D-638 | 6.6 | Kpsi | ||
| Flexural Modulus @ 23°C/73°FF | D-790 | 750 | Kpsi | ||
| Flexural Modulus @ 260°C/500°F | D-790 | 392 | Kpsi | ||
| Flexural Strength Ultimate @ 23°C/73°FF | D-790 | 16 | Kpsi | ||
| Flexural Strength Ultimate @ 260°C/500°F | D-790 | 10 | Kpsi | ||
| Elongation at break 23°C/73°F | D-638 | 2.1 | % | ||
| Elongation at break 260°C/500°F | D-638 | 4.6 | % | Compressive Strength @ 23°C/73°F | D-695 | 24.7 | Kpsi |
| Compressive Strength @ 260°C/500°F | D-695 | 11.2 | Kpsi | ||
| Compressive Strain @ 23°C/73°F | D-695 | 18 | % | ||
| Compressive Stain @ 260°C/500°F | D-695 | 31 | % | ||
| Poisson's Ratio @ 23°C/73°F | D-638 | 0.25 | |||
| Poisson's Ratio @190°C/374°F | D-638 | 0.32 | |||
| Young's Modulus@ 23°C/73°F | D-638 | 941 | Kpsi | ||
| Young's Modulus@ 260°C/500°F | D-638 | 539 | Kpsi | ||
| Wear and Friction | |||||
| PV Limit | E-831 | 500 | Kspi f/m | ||
| Coefficient Of Friction | 13.1 | P=187 psi, V=134 f/m | |||
| 8.0 | P=250 psi, V=400 f/m |
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| Thermal Properties | |||||
| CTE Parallel 23-300°C/73-572°F | E-831 | 33 | in. -6/in.°F | ||
| CTE Prep 23-300°C/73-572°F | E-831 | 19 | in. -6/in.°F | ||
| Thermal Oxidative Stability @ 371°C/700 °F * | 3.3 | % | |||
| *100 hours @ 70 psia, circulating air | |||||
| *The values shown in these and the following charts are typical, average properties. Actual values may differ due to variations in resin formulations and processing methods. These values are obtained from sources believed to be reliable, including the resin manufactures, converters and other published sources. However, they should not be used for specification or design purposes. |
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