Tamshell
Material Data Sheet

Material: Semitron® ESd 480

Static Dissipative Polyetheretherketone (PEEK®)

This PEEK® based static dissipative material provides a dissipative range of 106 - 109 ohms/sq. Semitron® ESd 480 is dimensionally stable, making it ideal for test fixtures. PEEK®'s chemical resistance makes it a good material for wafer handling devices and is a good option in wet environments where static dissipations is critical. Semitron® ESd480 is not subject to dielectric breakdown.

Mechanical Properties Test Method ASTM Value Units




Specific Gravity, 73°F D792 1.47
Tensile Strength, 73°F D638 14,500 psi
Tensile Modulus of Elasticity, °F D638 940,000 psi
Tensile Elongation ( at break), 73°F D638 1.5 %
Flexural Strength, 73°F D790 21,000 psi
Flexural Modulus of Elasticity, 73°F D790 1,000,000 psi
Shear Strength, 73°F D732
psi
Compressive Strength, 10% Deformation, 73°F D695 26,500 psi
Compressive Modulus of Elasticity, 73°F D695 570,000 psi
Hardness, Rockwell, Scale as noted, 73°F D785 M107 (R122)
Hardness, Durometer, Shore "D" Scale, 73°F D2240

Izod Impact (notched), 73°F D256 Type A 1 ft-lb/in of notch
Coefficient of Friction (Dry vs. Steel) Dynamic QTM 55007 0.2
Limiting PV (with 4:1 safety factor applied) QTM 55007 17,000 ft.lbs./in.2 min
Wear Factor "k" x 10-10 QTM 55010
in.3-min/ft.lbs.hr




Thermal Properties






Coefficient of Linear Thermal Expansion (-40°F to 300°F) E-831 (TMA) 1.7 x 10-5 in/in./°F
Heat Deflection Temperature 264 psi D648 500 °F
TG-Glass transition (amorphous) D3418 N/A °F
Meltin Point (Crystalline) peak D3418 644 °F
Continuous Service Temperature in Air (Max.) (1)
475 °F
Thermal Conductivity F433
BTU-in/hr-ft²-°F




Electrical Properties






Dielectric Strength, Short Term D149
Volts/mil
Surface Resistivity EOS/ESD S11.11
ohm/square
Dielectric Constant, 106 Hz D150

Dissipation Factor, 106 Hz D150

Flammability @ 3.1 mm (1/8 in.) UL 94 V-0
FDA Compliant
No
       
*The values shown in these and the following charts are typical, average properties. Actual values may differ due to variations in resin formulations and processing methods. These values are obtained from sources believed to be reliable, including the resin manufactures, converters and other published sources. However, they should not be used for specification or design purposes.
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