Material Data Sheet
Material: NEMA Grade G -11
Grade G-11 is constructed from a continuous filament woven glass fabric with an epoxy resin binder. The resin system is not flame retardant, but has greater temperature resistance than Grade G-10. Exhibits extremely high mechanical strengths at room temperature, and maintains a minimum of 30.0 ksi flexural strength at 150 degrees C. Good dielectric loss and electric strength properties under both dry and humid conditions.
Normally used for electrical and electronic insulation where low moisture absorption, good chemical resistance, and high physical strength is needed. Heat resistance is higher than G-10 where physical stress is imposed. Not recommended for wear applications. Available in sheets, rolled tubes and molded rods.
| Physical Properties | Value | Units | ||
| Density | 0.07 | lb/in³ | ||
| Water Absorption | 0.2 | % | ||
| Mechanical Properties | ||||
| Hardness, Rockwell M | 112 | |||
| Tensile Strength @ Break Crosswise | 37,000 | psi | ||
| Tensile Strength @ Break Lengthwise | 43,000 | psi | ||
| Flexural Modulus Crosswise | 2,700 | ksi | ||
| Flexural Modulus Lengthwise | 3,000 | ksi | ||
| Flexural Strength Crosswise | 70,000 | psi | ||
| Flexural Strength Lengthwise | 80,000 | psi | ||
| Compressive Strength | 63,000 | psi | ||
| Izod Impact, Notched Crosswise | 12 | ft-lb/in | ||
| Izod Impact, Notched Lengthwise | 9 | ft-lb/in | ||
| Electrical Properties | ||||
| Dielectric Constant | 4.5 | |||
| Dielectric Strength | 900 | V/mil | ||
| Dissipation Factor | 0.02 | |||
| Arc Resistance | 120 | sec | ||
| Thermal Properties | ||||
| CTE, linear 68°F | 7.2 | µin/in-°F | ||
| CTE, linear 20°C Transverse to Flow | 8.33 | µin/in-°F | ||
| Thermal Conductivity | 2 | BTU-in/hr-ft²-°F | ||
| Maximum Service Temperature, Air | 329° | °F | ||
| Flammability, UL94 | ||||
| *The values shown in these and the following charts are typical, average properties. Actual values may differ due to variations in resin formulations and processing methods. These values are obtained from sources believed to be reliable, including the resin manufactures, converters and other published sources. However, they should not be used for specification or design purposes. |
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